IEEE MobileCloud 2020
IEEE MobileCloud 2020
New date: August 3-6, Keble College, Oxford, United Kingdom
IEEE OpenPreview Conference
IEEE OpenPreview Conference
Co-located with IEEE SOSE 2020, IEEE Big Data Services, IEEE DAPPS 2020, and IEEE AITest 2020

2020 8th IEEE International Conference on Mobile Cloud Computing, Services, and Engineering (MobileCloud)

2020 IEEE BigDataService/MobileCloud/SOSE/AITest/DAPPS/JCC & Related Workshops Registrations
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IEEE MobileCloud2020 is IEEE OpenPreview conference
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New Date: August 3-6, 2020 Location: Keble College, Oxford, United Kingdom
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INTEGRATION OF MOBILE COMPUTING, EDGE AND CLOUD SERVICES

Process big data collected f rom mobile sensors, intelligent systems, smart homes, connected vehicles (V2X), and support Internet of things (IoT) with massive 5G, edge and cloud-based backend.

Organization Committee

Kaikai Liu

Technical Program Chair
San Jose State University, USA

Juan Li

Technical Program Chair
North Dakota State University, USA

Michele Rossi

Technical Program Chair
University of Padova, Italy

Hong Zhu

General Chair
Oxford Brookes University, UK

Sato Hiroyuki

General Chair, Steering Committee
University of Tokyo, Japan

Yan Bai

General Chair
University of Washington Tacoma, USA

Alessio Botta

General Chair
Università degli Studi di Napoli, Italy

 

 

IEEE CONFERENCE JOINT STEERING COMMITTEE BOARD

Axel Küpper, Technische Universität Berlin/Telekom Innovation Laboratories, Germany

Cristian Borcea, New Jersey of Institute of Technology, USA

Guido Wirtz, University of Bamberg, Germany

Hauiming Wang, National University of Defense Technology, China

Hong Zhu, Oxford Brookes University, UK

Jerry Gao, San Jose State University, USA (Executive Chair)

Jie Xu, University of Leeds, UK

Longbin Cao, University of Technology Sydney, AU

Sato Hiroyuki, University of Tokyo, Japan

W. T. Tsai, Arizona State University, USA

TECHNICAL PROGRAM COMMITTEE

Alessandro Mei, Sapienza University of Rome, Italy

Anand Tripathi, Univ. of Minnesota Minneapolis, USA

Atsushi Kanai, HOSEI University, Japan

Chun-Cheng Lin, Chiao Tung University, Taiwan

Cristian Borcea, New Jersey Inst. of Technology, USA

Dan Grigoras, UCC, Ireland

Dana Petcu, West University of Timisoara, Japan

Deniz Gündüz, Imperial College, London, UK

Emilio Calvanese Strinati, CEA-LETI, France

Fabio Costa, Federal University of Goias, Brasil

Francesco De Pellegrini, University of Avignon, France

George Roussos, University of London, UK

Giacomo Morabito, University of Catania, Italy

Haiping Xu, Univ. of Massachusetts Dartmouth, USA

Hao Han, The University of Tokyo, Japan

Hironori Washizaki, Waseda University, Japan

Iulian Sandu Popa, University of Versailles Saint-Quentin & INRIA Paris- Rocquencourt, France

Jia Zhao, JiLin University, China

Jun Kong, North Dakota State University, USA

Kaibin Huang, University of Hong Kong

Lei Ma, The University of Tokyo, Japan

Luca Foschini, University of Bologna, Italy

Mark Allison, University of Michigan-Flint, USA

Mauro Tortonesi, University of Ferrara, Italy

Muhammad Shahzad, North Carolina State Univ., USA

Ouri Wolfson, University of illinois, USA

Paolo Bellavista, University of Bologna, Italy

Paolo Casari, IMDEA Networks, Madrid, Spain

Paolo Dini, CTTC, Barcelona, Spain

Prasad Calyam, University of Missouri-Columbia, USA

Ragib Hasan, Univ. of Alabama at Birmingham, USA

Rami Haddad, Georgia Southern University, USA

Richard Han, University of Colorado Boulder, USA

Roch Glitho, Concordia University, USA

Sato Hiroyuki, The University of Tokyo, Japan

Sergio Ilari, University of Zaragoza, Spain

Shigeaki Tanimoto, Chiba Inst. of Technology, Japan

Shiwen Mao, Auburn University, USA

Stefano Secci, LIP6 UPMC, France

Thomas Richter, Rhein-Waal University of Applied Sciences, Germany

Ting Liu, Xi’an Jiaotong University, China

Volker Gruhn, Universität Duisburg-Essen, Germany

Wenjia Li, New York Institute of Technology, USA

Yao Guo, Peking University, China

Yuh-Shyan Chen, National Taiwan University, Taiwan

Yuji Sekiya, The University of Tokyo, Japan

CALL FOR PAPERS

The integration of mobile computing, edge and cloud services enables new applications that provide resources andservices on an intelligent basis, process big data collected from mobile sensors, connected vehicles and support Internet of things (IoT) with massive edge and cloud-based backend. 5G technology will be a key enabler of thisintegration. Such mobile applications will have tremendous impacts on many aspects of our life, including transportation/V2X, e-commerce, healthcare, smart homes and smart cities, social interaction, and many more.

Topics of Interest

Topics of interest include, but are not limited to:

Theory, Modeling and Methodologies

  • Mobile cloud computing models, architectures, and platforms Engineering on-demand mobile cloud systems and services Design of energy-saving mobile cloud protocols
  • Cloud-IoT integration, cloud-centric IoT and software defined IoT 5G MEC: emerging 5G network edge cloud architectures
  • Mobile crowd sensing models and platforms
  • Mobile cloud resource management, provisioning, and migration Mobile-aware cloud data management and data retrieval
  • Mobile cloud data centers, storage, and networking technologies for 5G Virtualization techniques for mobile cloud computing and services Data drivencomputing and caching for mobile cloud services
  • Artificial intelligence, machine and deep learning for mobile cloud applications
  • Security, reliability and privacy for mobile cloud computing

Applications and Industry Practice

  • Mobile multimedia and mobile social community services
  • Cloud-assisted human-centered applications based on wearable devices Mobile commerce and cloud-based marketplace
  • Intuitive user interfaces for cloud-based mobile applications Cloud computing for Vehicle-to-anything (V2X) scenarios Research case studies and experimental reports
  • Industry reports on experience and lessons learned Standardization on mobile clouds

Paper submission

IEEE Mobile Cloud 2020 solicits research papers describing novel and previously unpublished scientific contributions to the field of Internet of Things (IoT), edge computing, mobile cloud, mobile systems, intelligent systems, smart homes, connected vehicles (V2X), and5G connectivity and cloud services.

Two different types of papers can be submitted:

  • Regular papers (8 pages IEEE double column format)
  • Work-in-progress and workshop papers (6 pagers IEEE double column format)

All papers must be written in English. Manuscripts must include a title, an abstract with 200-250 words, and a list of 4-6 keywords. All papers must be prepared in the IEEE double column proceedings format. Please see: https://www.ieee.org/conferences/publishing/templates.html. Submitted papers should contain original work and not being submitted elsewhere. Each paper must be presented by an author at the conference. Presentations via teleconference are not permitted. Permissions to have the paper presented by a qualified substitute presented may be granted by the TPC Chairs under extraordinary circumstances, upon written request.

 

Important Dates

Submission  of research papers          December 1, 2019

Author notification                              January 15, 2020

Camera ready and registration         January 31, 2020

Conference                                          April 14-16, 2020 (Delayed to August 3-6, 2020)

VENUE

Location

  • IEEE Mobile Cloud 2020 will be hosted at: Keble College, Oxford, OX1 3PG, United Kingdom
  • Web: https://www.keble.ox.ac.uk
  • Directions to Keble College can be found [here]

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